Industry Leading
Quality
If We Can't Get lt, You Don't Want lt.
Visual Inspection
Utilize a stereoscopic
microscope for comprehensive 360° observation, examining aspects such as
product packaging, chip type, date, batch, printing, packaging state,
and pin arrangement. Visual inspection enables quick assessment of
compliance with original brand manufacturers external requirements,
including anti-static and moisture standards, for both new and
refurbished products.
Solderability Testing
This is crucial for
functionality, especially in hot, humid regions. It assesses oxidation,
prevalent in places like Southeast Asia and southern North America. We
follow J-STD-002 standards for thru-hole, surface mount, and BGA
devices. We use "dip-and-look" for non-BGA surface mount devices and the
"ceramic plate test" for BGA devices. Testing is recommended for devices
in improper packaging, those over a year old, or showing pin
contamination.
X-Ray
X-ray inspection
provides comprehensive 360° observation of component internals and
package connections. It identifies issues like mix-ups and ensures
conformity with specifications (Datasheet). This method assesses chip
and package pin connectivity, detecting abnormalities and ruling out key
and open-wire short circuits.
Functional/Programming
Testing
We design and test ICs
comprehensively through official datasheets, developing test projects,
building testing boards and platforms, and writing test programs. Our
professional chip function tests cover logic, analog, high-frequency,
and power ICs, as well as various amplifiers and power management ICs.
We handle diverse packages like DIP, SOP, BGA, SOT, QFN, and QFP. Our
programming equipment supports detection of 47,000 IC models from 208
manufacturers, including EPROM, EEPROM, FPGA, flash, microcontroller,
and standard logic devices.